BGA Solder Balls 0.3mm 25000pcs in Case

Product Description:

Lead-free BGA solder balls in 0.3mm diameter for BGA chip reballing and CSP package rework. Supplied in a clear case with 25,000 balls. SAC305 alloy for reliable BGA joints.

Specifications:

• Diameter: 0.3mm
• Quantity: 25,000 balls
• Alloy: SAC305 lead-free
• Melting Point: 217°C
• Applications: BGA reballing, CSP rework, chip-level board repair
• Warranty: 1-year warranty included