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    TheFactoryConnect

    Low Melting Point Solder Bismuth 140C 50g

    Low Melting Point Solder Bismuth 140C 50g

    $25.00 CAD
    $25.00 CAD
    Sale Sold out
    Shipping calculated at checkout.

    Product Description:

    Remove BGA chips without thermal damage. Bismuth-tin alloy melts at just 140°C — mix with existing solder on any pad to dramatically lower the rework temperature.

    Specifications:

    • Compatible Models: Low Melting Point Solder Bismuth 140C 50g
    • Type: Soldering Rework Tools
    • Alloy: Bi57Sn42Ag1 (bismuth-tin-silver)
    • Melt point: 140°C
    • Wire: 0.6mm diameter
    • For: BGA removal, low-temp rework
    • Weight: 50g
    • Warranty: 1-year warranty
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