Tacky Flux Paste 100g for BGA Reballing

Product Description:

High-tack flux paste specifically formulated for BGA reballing. The tacky consistency holds solder balls in position during reflow. Provides excellent activity for reliable ball bonding on substrate pads.

Specifications:

• Type: Tacky flux paste for BGA
• Volume: 100g tub
• Tack: High-tack — holds BGA solder balls
• Activation: Mildly activated, RMA
• Applications: BGA reballing, BGA rework, CSP package repair
• Warranty: 1-year warranty included